Flexible anti-metal design adheres closely to metal surfaces for longer reading distances.
Utilizing a high-frequency chip, this design addresses the issue of metal interference affecting UHF passive electronic tags, resolving problems such as card reading failure and poor stability.
High-frequency chip: NTAG213 I CODE SLIX FMIIRF08
Operating frequency: 13.56MHz
Protection rating: IP68
Description
High-temperature-resistant FPC RFID tags are characterized by their resistance to high temperatures and pressure, and—when combined with signal-absorbing materials—their ability to withstand interference from metal. They are commonly used in high-temperature environments for inventory management and control on assembly lines, for tracking incoming and outgoing goods, or for co-molding with injection-molded parts. During the injection molding process, the RFID chip remains unaffected by the high temperatures, ensuring it is not damaged. This allows the FPC-based RFID tag to be seamlessly integrated with the molded part, preventing the tag from being removed or counterfeited. This provides superior anti-counterfeiting capabilities and makes it widely applicable for product anti-counterfeiting and traceability.
Features
● Anti-metal interference
Incorporates signal-absorbing materials for optimal performance on metal surfaces
● FPC High-Temperature Resistant Material with IP68 Water and Dust Resistance
Ideal for outdoor use; the FPC encapsulation makes the tag resistant to high temperatures, waterproof, dustproof, lightweight, thin, and highly flexible. Operating temperature: -20°C to +85°C; Storage temperature: -20°C to +85°C
● Compact Size and Stable Performance
Due to material limitations, traditional etched aluminum antennas cannot be made smaller. Compared to aluminum, copper is more stable and resistant to etching, allowing for the production of smaller antennas with more stable frequencies. Manufacturing compact, high-precision antennas has long been a major challenge in the electronic tag industry, but the use of copper antennas has successfully resolved this issue.
● High-Temperature Resistance and Strong Resistance to High-Temperature Environments
The widespread adoption of NFC technology has driven the need for electronic tags with smaller form factors, more stringent environmental requirements, and thinner structures. From concept to implementation, we integrated material selection and industry-specific process requirements. Using a PI substrate and copper etching technology as a foundation, combined with industry-standard micro-bonding techniques and post-processing, we successfully developed this product. It features long-range performance, stable operation, a compact design, and high-temperature resistance, earning high satisfaction from users.
● Features include bend resistance, chemical resistance, and pressure resistance
Commonly used in high-temperature environments for production line inventory management, tracking of incoming and outgoing goods, or co-molding with injection-molded parts.
● Suitable for Special Applications
After comparing several chip packaging technologies currently used in the industry, we selected the COB (Chip-on-Board) process. Its stability has been verified over a long period and is recognized throughout the industry. This packaging process can be used in various harsh environments and accommodates different packaging formats in subsequent stages.
Application
1. Metal tool tracking and management
2. Embedded management of metal jigs
5. Asset management of metal surfaces with limited installation space, etc.
